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Effect of
potassium on micromorphological and chemical composition of
three cotton (Gossypium hirsutum L.) genotypes
M. E. Akhtar1,
M. Z. Khan1, S. Ahmad1*, M. Ashraf2
and A.
Sardar2
1National
Agricultural Research Centre, (NARC) Islamabad, Pakistan.
2Qauaid-i-Azam
University, Islamabad, Pakistan.
*Corresponding author. E-mail:
sagheer_1973@yahoo.com.
Accepted 6 July, 2009 |
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An experiment was conducted at National Agricultural
Research Centre (NARC), Islamabad, Pakistan to study the
effect of potassium on yield and internal leaf tissues
composition of cotton varieties, CIM-443, CIM-109 and
CIM-446. Nitrogen (N) and phosphorus (P) were applied at 150
mg N/kg soil and 75 mg P2O5/kg
soil to all the pots, while potassium (K) was applied
at three levels; control (no K), 100 and 200 mg K2O/kg
soil. It was observed that epidermal and mesophyl
cells were more turgid, uniform, flaccid, symmetrical and
structurally improved with potassium application. Larger
number of starch grains was observed in plant leaves grown
without potassium application while in leaves supplied with
K their number decreased. Thickness of the epidermal region
(cuticle plus epidermis) increased significantly with
potassium application and same was true for leaf thickness
in all the varieties. Application of K decreased N content
of leaves significantly while protein content increased.
Protein contents were maximum (65 µg/g) at 200 mg K2O/kg
soil over that of control treatment. Phosphorus
concentration also affected positively with potash
application and it was maximum at 100 mg K2O/kg
soil. An increase of 15.63% in leaf chlorophyll
content was recorded with K at 200 mg K2O/kg
soil. Seed cotton yield of all the varieties increased
significantly with K application, maximum in case of CIM-446
followed by CIM-109 and CIM-443 variety. A strong positive
correlation was observed among applied K, leaf thickness,
epidermis layer, chlorophyll contents, protein and seed
cotton yield.
Key words:
Cotton, mesophyl cells, starch grains, protein, seed cotton
yield, K applicatiion. |